ANSYS SimEDGE 2024 Virtual Conference Singapore
SimEDGE 2024 Event Registration Link:
https://simedge.ansys.com/register
About Simulation-Enabled Design Innovations for Next-Gen Electronics [SimEDGE]
The high-tech, semiconductor, and electronics industries are at the forefront of a transformative shift, driven by the need for next-generation technology innovations. As we approach the Ansys SimEDGE event on December 17, 2024, it's essential to understand how simulation is revolutionizing product design and innovation across the electronic systems value chain. This year's theme, "Accelerating Product Design and Innovation for Electronic Systems Value Chain," reflects the industry's urgent need to adapt to rapid advancements in computing and storage capabilities, networking and communication breakthroughs, and innovations in semiconductor packaging and fabrication. As companies strive to create faster, more efficient, and highly integrated systems, they face significant engineering challenges that demand innovative solutions.
The Role of Simulation in High-tech, Semiconductor & Electronic Industries
Simulation is pivotal in overcoming these challenges. It allows engineers to:
- Rapidly prototype designs
- Optimize performance while ensuring power efficiency
- Streamline engineering processes to meet cost and time-to-market goals
By leveraging simulation technologies, businesses can accelerate their innovation cycles, reduce time-to-market, and gain a competitive edge in the fast-evolving landscape of next-gen electronics.
What is the Ansys SimEDGE Event
The Ansys SimEDGE event will gather engineering leaders and experts from the global high-tech, semiconductor, and industries. Attendees will engage in discussions about emerging trends, challenges, solution practices, and the vital role of simulation in driving innovation.
Key Topics Covered
Participants can look forward to insightful sessions on:
- Next-gen technology trends
- Multi-scale and Multiphysics simulation
- Digital engineering (AI, cloud computing, GPU utilization, Model-Based Systems Engineering (MBSE), digital twin technologies)
- Chip-package-system integration
- Optics and photonics
- Packaging, assembly, and testing
- Domain focus areas including data centers, memory and storage solutions, networking and communication technologies, manufacturing processes, assembly techniques, and testing methodologies.
Who Should Attend?
The event is tailored for a wide range of professionals involved in the electronics sector:
- OEMs/Device Manufacturers
- Chip Manufacturers and Foundries
- Equipment Manufacturers
- OSAT Companies and IC Design Houses
- Engineering Service Providers
- Research Institutes
Final Thoughts on SimEDGE registration
Don't miss this opportunity to connect with industry leaders and explore how simulation can empower your design innovations. Join us at Ansys SimEDGE 2024 where together we will shape the future of electronics through simulation-enabled design innovations. Register today to secure your spot in this transformative event!
Secure your spot now: https://ansys.me/3zR7sIY
CADIT Distributes & Supports Ansys Electronics HFSS, HFSS-IC, SIwave, Icepak, Sherlock & Ansys Mechanical Solutions.
CADIT distributes Ansys HFSS, Ansys HFSS-IC, Ansys SIwave, Ansys Icepak, Ansys Sherlock, Ansys Electronics and Ansys Mechanical solutions in Singapore, Thailand, Malaysia, Philippines, Indonesia, Brunei, Cambodia, Laos, Myanmar, Vietnam.
CADIT is proud to be an official Elite status Distributor Channel Partner & Service Provider for Ansys Products in the Asia Pacific region since 1993.
Ansys for Printed Cirbuit Boards (PCB), Integrated Circuits (IC) & IC Packages (ICP) Additional Resources
https://www.ansys.com/applications/pcbs-ics-ic-packages
Subscribe to get the heads up on future industry events such as Ansys ASEAN Optics Virtual Summit 2024, Optics & Photonics Webinars and Events, & the latest in Simulation & Industry 4.0 News.