Ansys HFSS-IC

Ansys HFSS-IC is a specialized electromagnetic simulation solution designed for advanced IC packaging, RFICs, MMICs, and 3D-IC systems. It extends the industry-standard HFSS solver to address the growing complexity of multi-die, high-frequency, and high-speed chip designs where parasitic effects, signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) can cause critical failures if not properly managed.

HFSS-IC enables designers to simulate the full electromagnetic behavior of their ICs, packages, and interconnects with sign-off accuracy — before fabrication. It supports direct import of layout data from industry-standard design tools and allows system-level modeling across chip, package, and board, ensuring accurate prediction of signal degradation, coupling, and power delivery challenges.

This solution is widely used in industries like semiconductors, wireless communications, automotive electronics, and aerospace, where advanced packaging and high-speed interconnects are pushing traditional design tools to their limits. HFSS-IC competes with solutions from Cadence, Synopsys, and Keysight but is recognized for its unmatched simulation accuracy in solving complex EM challenges at the IC and system level.

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