MIMOS High Value Semiconductor Technology Seminar

MIMOS High Value Semiconductor Technology Seminar

In this seminar, you will be able to gain firsthand experience on the power of Ansys CAE Solution: Paving the Way for Future Semiconductor


About This Event

We are pleased to invite you to the MIMOS High Value Semiconductor Technology (HVST) Seminar with the theme on Advanced Packaging technology. In this workshop, you will be able to gain firsthand experience on the power of Ansys CAE Solution: Paving the Way for Future Semiconductor Technology Advancements. This complimentary event features engineering experts and thought leaders from related industries sharing best practices in creating breakthrough products and processes.

Successful application of product and process simulation (Computer Aided Engineering – CAE) technologies in advanced packaging, semiconductors and advanced electronics will be shared.

Learn about the latest CAE simulation tools for trending product development and packaging technologies, including workflows for solving complex multi-disciplinary design and engineering problems in the industry. This an opportunity you cannot afford to miss! Space is limited! Register today!

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